vPlate is Atotech’s new vertical continuous copper plating equipment, which the company says deposits copper on advanced PCB panels and is suitable for mSAP/SAP technology.
Their new plating solution provides customers with best results using advanced manufacturing technologies such as mSAP or SAP and can be applied to various PCB types, ranging from standard multilayer and HDI to advanced HDI, Rigid-Flex and IC substrates.
Atotech says uniformities of ±10% can be realized leveraging their concept for insoluble segmented anodes with adjustable anode and cathode shielding. Through touch-free transportation of thin panels (down to 36µm + 2×2 Cu clad), the company says they fulfill all market requirements for vertical continuous copper plating.
The new system is fully automated and therefore automatic loading/unloading, copper replenishment, panel size adaption and RFID recognition come as standard features with the new vPlate system. Atotech says it could be further upgraded by automatic grease supply and jig monitoring. They also put a lot of effort in making the new system as operator-friendly as possible, as well as provide customer flexibility in regards to line length or width requirements, therefore throughput, copper thickness and panel dimensions.
Atotch says the line layout can vary from one process to process track with each track up to 14 plating cells (app 34m plating length).
Visit https://www.atotech.com/products/electronics/electronics-equipment/vplate/
