Silvio Bertling has joined Hendor as Vice President of Sales for the U.S. and Canada.
In his new role at Hendor-pe, Bertling will be responsible for expanding both the Hendor and plating electronic presence and business within the present North American markets, but with a strong focus on new markets and applications.
After receiving his bachelor’s degree in business and marketing, Bertling spent his career of more than 35 years as an electronics and marketing engineer, specializing in printed circuit board (PCB) and materials development. He has lived in Germany, Russia, and since 1996, in the U.S.
During this time, he has been active in business affairs in the U.S., Europe, and Asia. The major focus of his business activities has been looking for new sales opportunities and technical support for OEMs for the enhancement of their products and services.
A few of Bertling’s key accomplishments are setting up a North American distribution system, being elected to Circuit Foil’s Board of Directors in August 2014, published several white papers, co-authored the book “Lead-free Soldering Process Development and Reliability”, and received several IPC awards.
Hendor-pe, inc. is a joint venture between Hendor and plating electronic, providing the surface finishing industry in the USA and Canada with Hendor pumps and filters along with plating electronic switch mode DC and Pulse/Pulse Reverse rectifiers.
Hendor is an innovative manufacturer of high-quality corrosion resistant chemical pumps and filters, based in the Netherlands and founded in 1948. For 75 years, Hendor has manufactured and supplied a wide range of high-quality pumps and filters for the metalworking industry, printed circuit boards, connectors and semiconductors.
Founded in 1987, Plating Electronic is a globally established supplier of innovative, energy-efficient DC rectifiers and Pulse Reverse power supplies based in Germany. For more than 35 years, plating electronic has been developing sophisticated power supply solutions, based on switch mode topologies, for industrial and scientific electrochemical processes in numerous application areas, from electroplating, PCB manufacturing, surface treatment of aluminum (anodizing), cathodic dip coating (e-coating), Power-to-X (H2), Plasma coating (PEO, MAO) to electrolytic water treatment.
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