Sharretts Plating Company announced a strategic expansion into wafer-level metallization for semiconductor and microelectronics applications by hiring John Ghekiere.
John Ghekiere is a semiconductor industry veteran with over two decades of experience in process development and equipment engineering. He has held leadership roles at Applied Materials and ClassOne Technology, working across electroplating, advanced wet processing, TSV/interconnect architectures, and semiconductor capital equipment development.
“At SPC, we are developing advanced wafer-level electroplating and electroless plating capabilities—critical process steps in modern semiconductor fabrication,” says Stephen Sharretts, CEO. “This initiative is focused on building scalable, production-ready plating solutions that meet the performance, uniformity, and reliability requirements of next-generation devices.”
Sharretts says this marks a meaningful step in their strategy to expand into high-growth, technically demanding markets where execution, process control, and engineering depth are decisive.
Headquartered at its 70,000-square-foot South Central Pennsylvania production facility, Sharretts Plating Company is a full-service plating business that has built an international network of proprietary chemical and industrial plating partners committed to satisfying your most demanding technical, time-to-market and economic requirements. Theor current initiatives include building a new production line that will further reduce lead times to better serve its customers.
