Uyemura, a global leader in final finishes and functional coatings, has introduced a unique plating alternative for the electrolytic deposition of nickel phosphorus alloy layers.
Niphos 6500 was developed to eliminate common, problematic “bottlenecks” on R2R lines. It does this at an extraordinary level: Niphos 6500 plates twice as fast as conventional electrolytic nickel processes while maintaining the same phosphorus level in the plated layer.
Niphos 6500 has a phosphorus content of 6 -11 %, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection.
Niphos 6500 has widespread application. It is an exceptional intermediate layer for hard-gold plating, reducing gold thickness and resulting in significant cost savings. It has shown strong performance in high-frequency connectors and sensor applications.
Used on high-stress automotive and industrial components, it increases durability, reduces friction, retards wear, and helps manage heat transfer. It also enhances surface hardness: Niphos 6500 has an HV of 550-600.
This unique electrolytic nickel is chloride-free and pH stable. Current density is 600 ASF.
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