Renny Fritz was named Business Development Manager for Hendor and Plating Electronics in the United States and Canada.

In his new role at Hendor-pe, Fritz will be responsible for expanding the Hendor and plating electronic presence and business within the present U.S. and Canadian markets, but with a strong focus on new markets and applications.

Fritz has worked in the finishing industry since 1990 and has held various positions. He began his career as a fabricator and then progressed to roles in customer service, spare parts, inside sales, project management, equipment sales, and technical sales management for the metal finishing industry.

With 34 years of experience in the field and an associate degree in general studies, Fritz has gained extensive knowledge of the equipment used in the industry. Although he has explored the pretreatment and paint finishing sectors, he ultimately returned to the metal finishing industry, where he built his expertise.

Hendor-pe is a joint venture between Hendor and Plating Electronics, providing the surface finishing industry in the U.S. and Canada with Hendor pumps and filters along with plating electronic switch mode DC and Pulse/Pulse Reverse rectifiers.  

Hendor is an innovative manufacturer of high-quality corrosion-resistant chemical pumps and filters, founded in the Netherlands in 1948. For 75 years, Hendor has manufactured and supplied a wide range of high-quality pumps and filters for the metalworking industry, printed circuit boards, connectors, and semiconductors.

Founded in 1987, Plating Electronic is a globally established supplier of innovative, energy-efficient DC rectifiers and Pulse Reverse power supplies based in Germany. For more than 35 years, plating electronic has been developing sophisticated power supply solutions based on switch mode topologies for industrial and scientific electrochemical processes in numerous application areas, from electroplating, PCB manufacturing, surface treatment of aluminum (anodizing), cathodic dip coating (e-coating), Power-to-X (H2), Plasma coating (PEO, MAO), and electrolytic water treatment.